Hello,
is the C moulding factor used also for the Failure rate associated with components in micro-cases (integrated circuits, transistors, diodes) ? The formula for the component (pg 186 for FIDES 2022, pg 166 for FIDES 2009) does define the Cmoulding as a parameter, but it does not seem to actually define a Cmoulding table like the other components do.
Hi Gabriele,
Yes the Cmoulding factor is used for the failure rate associated with components in micro-cases. The Cmoulding table is the same as the other models, but yes there no table in the micropackaged components sheet. Thanks for the feedback, another thing to fix in the guide