Application Domains

The FIDES methodology applies to all domains using electronics :

  • Aeronautics
  • Space
  • Navy
  • Military
  • Automotive
  • Railways
  • Industry
  • Production and distribution of electricity
  • Telecommunications
  • IT, home automation systems, electrival appliances, etc.

Model Coverage

The FIDES methodology models failures whose origins are intrinsic (item technology or manufacturing and distribution quality) and extrinsic (equipment specification and design, selection of the procurement route, equipment production and integration) to the items studied.

The methodology takes the following into account:

  • failures resulting from development or manufacture errors.
  • overstresses (electrical, mechanical, thermal) linked to the application and not listed as such by the user (the occurrence of the overstress remains hidden).

The methodology does not handle the following failures:

  • software failures.
  • unconfirmed failures.
  • failures linked to unperformed preventive maintenance operations.
  • failures linked to accidental aggressions when identified or acknowledged (propagation of failures, use outside the specifications, improper handling: the occurrence of the overstress is known).

The FIDES methodology covers non-operating phases, whether standby periods between utilizations or actual storage.