Hello,
at pag 213 of the 2022 user guide, it seems that only the basic failure rates associated with the packages refers to the failure rates provided for non-RF/MW discrete semiconductor packages but i am not sure if also the failure ratefor the basic failure rates associated with the chip refers to the failure rates provided for non-RF/MW discrete semiconductor packages, therefore does the value of Lambda 0TH need be multiplied by √N only for non-RF/MW discrete semiconductor packages or also for RF/MW discrete semiconductor packages?
Hi Gabriele,
In theory, this √N should also apply to RF/MW discrete semiconductor packages, but there is no specific advice on this topic in the discrete HF-RF model.
I'm a bit surprised. I will have a look in the files next week when I come back to the office.
Hi Gabriele,
In theory, this √N should also apply to RF/MW discrete semiconductor packages, but there is no specific advice on this topic in the discrete HF-RF model. I'm a bit surprised.
I will have a look in the files next week when I come back to the office.