Hi,I plan to design a circuit (off board) that works in a vacuum cell. I guess that sealed components like electrolytics capacitors are not happy in this conditions. Moreover, the moisture sensitivity can be worse with pressure cycling. On the other hand, non-pressurized electronics may have been analysed for avionics needs. I have not any knowledge on this topic. Should I take in account this constraint, and how?Best regardsLaurent
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Sun, 09/03/2014 - 21:46#1
Of course the pressure cycling has to be tackled in the product design!
Nevertheless pressure and pressure cycling have not been considered as major contributors to reliability for FIDES models. Indeed, it is assumed they have no direct effect on component without cavity. As you mention, pressure cycling is known as a possible factor that helps humidity to penetrate inside equipments. When determining the RH factor in a FIDES life profile you should consider it to input a realistic RH.
For some component like relays that do have a cavity, qualification of the component to pressure and pressure cycling should be considered carefully, but there is no models for that in FIDES.
At the end of the day pressure and pressure cycling are considered as a specific concern and is not covered within FIDES.
If you have clues or evidences it is important for electronic reliability, please advise us!
Ok Lambda, so I will use components without cavity, prefer high voltage ceramic capa if needed, and MSL1 packages for active circuits. There will be 3mm LED and Photodetectors. I'll have feedback in 2015.Best regardsLaurent