I am wondering whether someone can provide a detailed definition of the four Printed Circuit Board types (Blind via, micro-via technology, pad on via technology, and via). I understand these are names of different via structure in board, but if we have a substrate containing multiple types of via, which type should we use for reliability modelling?
I consulted our PCB specialist and they could only explain to me like this:
"In PCB or substrate terminology, blind via is a kind of via, it can be laser drilled via. Micro-via is also laser drilled via as we normally refer to. Pad on Via could be the IVH or mech drill via with cap." They want to see a clear definition of the PCB types so they can advise my selection here.