C moulding factor for Failure rate associated with components in micro-cases (integrated circuits, transistors, diodes)

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Tue, 28/10/2025 - 00:08
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Gabriele
C moulding factor for Failure rate associated with components in micro-cases (integrated circuits, transistors, diodes)

Hello, 

is the C moulding factor  used also for the Failure rate associated with components in micro-cases (integrated circuits, transistors, diodes) ? The formula for the component (pg 186 for FIDES 2022, pg 166 for FIDES 2009) does define the Cmoulding as a parameter, but it does not seem to actually define a Cmoulding table like the other components do. 

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