Modèles

Hello,

On the latest FIDES guideline it is possible to indicate the use of Underfill process for specific packages (P. 127):

Hello,

when calculating the failure rate of a microcontroller should the lambda_0_th be simply 0.075, or should every part of the microcontroller be considered and evaluated separately? For example,

• 0.075 for the core,
• 0.053 for the internal SRAM,
• 0.06 for internal Flash and 3x0.021 for the GPIO/PWM and I2C modules.

Obviously the latter results in a much higher failure rate so using that (even if incorrect) would mean an error towards safety but i wonder what the authors had in mind.

Hello,

I would need a model for the ldc ink  capacitor but unfortunately  it seems that FIDES standard don't includes one. , Is there any model that I can use?

How is assumed the QA_Component factor for a Weibull distribution (es level B)?

Hi everyone,

which Description appendix 1/2 is better in defining a Thermistor and a Plastic Capacitor?

Thank you.

ES

Why in the evaluation of the acceleration factor of thermal cycling the simplified formula is assuming an activation energy Ea = 0.122eV? In particular, for the failure rate evaluation of the integrated circuit, the pi_thermal is assuming an activation energy of 0.7, while the pi_tcycase and pi_tcysolderjoints are assuming an Ea of 0.122eV.

I have been experiencing the FIDES tool failing to generate values for 2 sheets. I have had success with other sheets, with the same operational profile and pi factors - but for some reason i am unable to acquire a value for 2 sheets. Is there any way to identify what the route cause for the 'failed calculation' is? The CMD log offers no information, nor the XML extract.

Any support would be appreciated.

We are currently working on the implementation of FIDES 2022 in our software iQT.

I have a question related to the calculation of COTs boards. Our current implementation is based on FIDES Guide 2009 issue A. The Pi Factor calculation for COTs is on page 200 of the original standard. 

The following are the equations used for Pi_Tcy_solderjoints and Pi_Tcy_cases

In the latest 2022 standard, it seems that the equations used for these two factors are swapped. This is the screenshot from page 227 of the latest 2022 standard:

Hello everyone, 

In page 111 of FIDES Guide 2022 English version, transils and transorbs are considered as protection components.  My understanding of these components is as follows:

1. Transils: ESD suppressors manufactured by STMicroelectronics

2. Transorbs: Transient-voltage-suppression diode.

Is my understanding correct or not?

Hello everyone, 

For electrical components, some quality assurance standards in the table "Pi-PM: Model associated with the QAcomponent factor" should be updated.

For example, FIDES guide 2022 English version:

1. In page 123, quality assurance standards "NASDA-QTS-XXXX" should be updated as "JAXA-QTS-XXXX".