Hi all,
When calculating using the FIDES parts count method, which category should SSDs be classified under? SSD is "Solid State Drive" and SSD has SATA interfaces in this case.
I'm considering to classify SSD under "EIDE" of hard disk category, but if you have a better idea, please let me know.
Hello,
I am trying to calculate the Li‑Ion battery failure rate using the model from FIDES 2022 in a scenario where the number of charge/discharge cycles per year (NbCD_Annual) is less than 50 per year and where no maintenance is performed.
Based on my understanding, the current model does not provide an adequate estimation of wear‑out behaviour for such low cycling conditions.
Hi,
I have a component "EPC2016C - Enhancement Mode Power Transistor" which is a Gallium Nitride FET. The "GaN RF/MW components" model mentioned in FIDES Guide 2022 seems suitable to use for this component.
However, this model is not available in de Fides template. Is there a way I can enter each PI-factor or final component lambda results from a hand calculation based on FIDES Guide 2022 into the Fides template? If not, what component and model would you recommend to select to get a fair result.
Kind regards,
Sara
Hi,
Can someone please clarify what qualifies as 'Connectors for printed circuits (and similar)'?
Hello, noticed something in the standard that is confusing me.
For RF/MW GaN components and GaAs components, the pi thermal factor calculation (pg 204 and 208, respectively) calls for a check of T_jcomponent versus T_ref.
The formula for when T_jcomponent < T_ref seems normal.
But the formula for when T_jcomponent >= T_ref does not seem to include the temperature portion of the exponent? Is this correct? If not, is it supposed to be the same as the formula above, or is there another calculation that should actually be occurring here instead?
Bonjour,
Voulant utiliser la méthode par type d'articles de la version 2022 pour une évaluation préliminaire, je m'aperçois qu'il manque certaines infos, ou alors je ne les ai pas trouvées :
Bonjour a tous,
Je souhaite intégrer dans l'onglet "electronic component" d'expert TOOL un LDO TL1963A (en SOT-263)...
A l'heure actuelle, je l'ai renseigné en circuit intégré "ECIC", SOT233, SOT83 medium power "ECDS 03" car je l'utilise en plage basse (5V en sortie)...
Avez-vous une meilleur definition?
j'avoue avoir hesité entre circuit intégré (ECIC) et emiconducteur discret (ECDS)
Merci d'avance pour votre aide.
Thomas C.
Hi Everyone.
I try to define the "insert temperature rise" for the connectors.
Hello,
Please let me know the confidence level of FIDES. For reference, I believe the confidence level of MIL-HDBK-217 is 60%.
Miyuki Miyaoka
In the last FIDES there is an evolution on the computation of acceleration factors of integrated circuits and discrete semiconductors components: