Modèles

Dear Lambda,

Does Fides include TWT reliability modeling? Actually, I would be interested by Deep storage reliability for a very long period.
Thanks for your support.

Giral

Hello,

How can I modelize a single package with two transistors, for example an IRF7389PbF (two MOS FET in a SO-8 package)?

Shall I consider only one chip, two, or square(2)?

And how shall I enter such a modelization in the FIDES Mill Tool?

Marie

Bonjour Monsieur Lamda,

Pouvez-vous me confirmer que les modélisations suivantes sont toujours valides:

Hello,

How can I modelized a LED ?
My first intuition is to used: Component type=Discrete semiconductor circuits, Silicon, junction < 5W ?

Are you agree with it ?

Thanks,
FT

The failure rate predicted with the FIDES Guide 2004A for ceramic capacitors with high C.V product is sometimes very high, especially if the life profile has strong thermal cycling.

This high failure rate is the expression of the technological difficulty to have a high capacity with a strong insulation in a small package with ceramic capacitor. Nevertheless, the failure rate predicted with FIDES is perhaps too penalizing for ceramic capacitor with high C.V product (and especially for type 2 ceramic capacitors).

In the Fides guide (Page 53), the Π Placement factor is defined by the items below:

Non-interface digital function

Interface digital function

Non-interface low level analog function

Interface low level analog function

Bonjour,

J′aimerais calculer le taux de défaillance d′un accéléromètre MEMS pourvu d′un boîtier JCLCC à 8 broches.

Les boîtiers JCLCC dans FIDES ne commencent qu′à 20 broches. Comment résoudre mon problème?

Merci,

Marie

First, hello Fides and thanks for this website !
Do the fuses and/or protection devices are taken into account ? If not, can it be expected ?
More generally, could it be possible to know components that are envisaged to be added in a close future ?