I need some help in the FIDES mathematical model. In the IEC 62380 mathematical model for failure rate estimation of electronic components consists of Die Failure (λdie)+ Package failure (λpackage) + λoverstress.
Similarly in the FIDES, is it possible to get the failure rate for internal die failures (λdie) & Package failures (λpackage)? In the existing physical model representation, is it possible to split this data?
or Do you have any assumption in percentage of failure rate can be used for Die failures and package failures in the existing λphysical failure rate?
Thanks in advance for your support.