are these components considered in the FIDES model?
No, sorry, there is no optic component in FIDES Guide. And this is not planned...
A model dedicated to ASIC is in the coming soon (...) 2009 edition. This model describes ASIC as... Application Specific Integrated Circuits (!). Consequently, the model is the same as for IC but with a specific process factor and a specific part manufacturing factor. In the meantime you can model the ASIC like an IC with a rather severe Pi_part_manufacturing.
The FIDES answer is: most probably no. The piece of hardware "ASIC" is probably not so reliable as the piece of hardware "FPGA".
The hardware design of an ASIC is specific an therefore more exposed to weakness.
But: This answer is for an hardware point of view, at component level only. FIDES doesnt take software into account. FIDES doesnt take radiation and transitory failure into account. All these topics are taken into account by specific means, described in specific standards, for example IEC 61508 or IEC 62396. And ASIC are often said to be less sensitive to these concerns.
Therefore ASIC are still often prefered to FPGA if a safe operation is a requirement.