Models

I have been experiencing the FIDES tool failing to generate values for 2 sheets. I have had success with other sheets, with the same operational profile and pi factors - but for some reason i am unable to acquire a value for 2 sheets. Is there any way to identify what the route cause for the 'failed calculation' is? The CMD log offers no information, nor the XML extract.

Any support would be appreciated.

We are currently working on the implementation of FIDES 2022 in our software iQT.

I have a question related to the calculation of COTs boards. Our current implementation is based on FIDES Guide 2009 issue A. The Pi Factor calculation for COTs is on page 200 of the original standard. 

The following are the equations used for Pi_Tcy_solderjoints and Pi_Tcy_cases

In the latest 2022 standard, it seems that the equations used for these two factors are swapped. This is the screenshot from page 227 of the latest 2022 standard:

Hello everyone, 

In page 111 of FIDES Guide 2022 English version, transils and transorbs are considered as protection components.  My understanding of these components is as follows:

1. Transils: ESD suppressors manufactured by STMicroelectronics

2. Transorbs: Transient-voltage-suppression diode.

Is my understanding correct or not?

Hello everyone, 

For electrical components, some quality assurance standards in the table "Pi-PM: Model associated with the QAcomponent factor" should be updated.

For example, FIDES guide 2022 English version:

1. In page 123, quality assurance standards "NASDA-QTS-XXXX" should be updated as "JAXA-QTS-XXXX".

Bonjour, 

Nous utilisons des mémoire de type FRAM dans nos boitiers électroniques, sous FIDES, quels types de mémoire vous recommandez ? 

Merci par avance 

Stéphane MICHEL

bonsoir,

j'ai une question d'un client à laquelle je ne sais pas répondre.

est-il possible de rentrer des taux de défaillance mise à disposition par le constructeur de composants un onglet de petits expertool.

Merci

Bonjour, 

je voudrais savoir comment vous modélisez les thermistances sous FIDES comme les références suivantes : 

- PTS080501B100RP100

- ERTJ1VA101J

Merci par avance. 

Stéphane MICHEL - Nexter

Hi everyone, I am a beginner in the FIDES world and I need help to classify in a correct way a Limiter.

in the circuit analyzed I had a: "High power, wideband GaAs VPIN limiter capable of protecting sensitive receive channel components against high power incident signals"

How I can classify it?

I originally put it in the section HF e RF Components ---> AsGa Integrated Circuit  but i'm not sure that it is correct and how to proceed.

Thank's in advance for the help

 

Hello,

We are using FIDES with IMdR software and Excel templte spreadsheet.

How can we set junction temperature of a component (exemple a MOS) ? we could only set a temperature rise, but i think, the result shall be different depending of the max temperature junction 

Regards,

Cyril LE HENANFF

Hi,

I am wondering whether someone can provide a detailed definition of the four Printed Circuit Board types (Blind via, micro-via technology, pad on via technology, and via). I understand these are names of different via structure in board, but if we have a substrate containing multiple types of via, which type should we use for reliability modelling?

I consulted our PCB specialist and they could only explain to me like this: